貼(tie)(tie)片(pian)(pian)(pian)(pian)(pian)機(ji)貼(tie)(tie)片(pian)(pian)(pian)(pian)(pian)的(de)元(yuan)器(qi)件(jian)(jian)主要(yao)包括:矩形貼(tie)(tie)片(pian)(pian)(pian)(pian)(pian)元(yuan)件(jian)(jian)、圓柱(zhu)形貼(tie)(tie)片(pian)(pian)(pian)(pian)(pian)元(yuan)件(jian)(jian)、復合貼(tie)(tie)片(pian)(pian)(pian)(pian)(pian)元(yuan)件(jian)(jian)、異形等貼(tie)(tie)片(pian)(pian)(pian)(pian)(pian)元(yuan)件(jian)(jian)。表面貼(tie)(tie)裝(zhuang)器(qi)件(jian)(jian)主要(yao)包括:二管、晶體管、集成電路等貼(tie)(tie)片(pian)(pian)(pian)(pian)(pian)半導體器(qi)件(jian)(jian)。
貼片(pian)機對貼片(pian)元器件的要求(qiu)主要有(you):
1、元器(qi)件形狀(zhuang)標準(zhun),便于定位,適合于自(zi)動化組(zu)裝。
2、元器件(jian)尺寸標準,貼片元器件(jian)的尺寸精度應與表面組(zu)裝技術(shu)和(he)表面組(zu)裝結(jie)構的尺寸精度相匹配,以便能(neng)夠互換。
3、元器件的電(dian)學(xue)性能需要(yao)符合標(biao)準化要(yao)求(qiu)(qiu),重(zhong)復性和(he)穩(wen)定性好。其(qi)機械(xie)強度(du)應滿(man)足(zu)組裝技術的工藝要(yao)求(qiu)(qiu)和(he)組裝結構的性能要(yao)求(qiu)(qiu)。
4、元(yuan)器件中(zhong)材料的耐(nai)熱性(xing)能(neng)(neng)應能(neng)(neng)夠經受(shou)住焊接工藝(yi)的溫度沖(chong)擊,不易燒壞。表(biao)層化(hua)學性(xing)能(neng)(neng)能(neng)(neng)夠承受(shou)有機溶液的洗滌。
5、元器件(jian)外部引出端(duan)的(de)位(wei)置和(he)材(cai)料性質應有利于(yu)自(zi)動(dong)化焊接工藝,且(qie)外部結構適合編帶包裝,型號或參數(shu)便(bian)于(yu)辨認。
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